Researchers at TU Bergakademie Freiberg have developed a compostable printed circuit board substrate made from fungal mycelium recovered as a byproduct of industrial citric acid production. Conventional printed circuit boards typically use glass fiber-reinforced fossil epoxy resin, making them difficult to recycle or biodegrade. The researchers instead used residual biomass from the industrial cultivation of the Aspergillus niger fungus to produce a dense, plastic-like substrate known as AnimatPCB.

The team processed the mycelium through molding and air-drying to create plates approximately 5 mm thick. The resulting material has a density of 1.23 grams per cubic centimeter, which is comparable to that of conventional printed circuit board materials.

Researchers used direct ink writing and a standard etching process to apply conductive structures to the fungal plates. Electronic components were then attached through manual soldering, demonstrating that the material could function as a substrate for low-complexity electronic circuits.

Industrial Sustainability Monthly: TU Bergakademie Freiberg working prototype of a compostable electronic circuit board made from fungal mycelium.

A working prototype of the compostable fungal mycelium electronic circuit board developed by researchers at TU Bergakademie Freiberg.

“In laboratory tests, the material from fungal mycelium shows high mechanical properties and good heat stability,” said Nina Oehlsen, a doctoral student at TU Bergakademie Freiberg and first author of the study. “Although the electrical properties are still below those of standard PCBs, fungal mycelium is sufficient for prototype or low-frequency applications – such as environmental sensors, consumer goods, and toys.”

The material remains below the electrical performance of standard printed circuit boards and requires further development before it can be considered for broader commercial use. The researchers said it must undergo testing under standards such as IPC-A-600 and DIN EN 60249-1, with water absorption identified as an area requiring further optimization. The fungal substrate can be redispersed in water at the end of its useful life, allowing the electronic components to be separated and recovered.

In addition, the researchers demonstrated that recovered transistors remained operational after being removed and resoldered onto a conventional circuit board. This recoverability could be particularly valuable as global electronic waste continues to increase. The Global E-waste Monitor projects that annual electronic waste generation will reach approximately 82 million metric tons by 2030.

A life-cycle assessment found that the fungal mycelium substrate had an embodied carbon footprint approximately 56% lower on average than a conventional printed circuit board substrate. The material also avoids the need for additional fossil raw materials by repurposing an existing biotechnology production residue.

“We have created a high-quality, functional material from an industrial waste product – without additional fossil raw materials,” said Linus Stegbauer, junior professor for biogenic technical materials at TU Bergakademie Freiberg. “In comparison to a conventional circuit board, fungal mycelium has up to 56% lower CO2 footprint and can be easily and safely dissolved in water at the end of its life.”

The material exhibited compressive strength of up to 121 MPa, a flexural modulus of 2.3 GPa and flexural strength of 30 MPa. It is fully biodegradable under ISO 20200, has low flammability and provides favorable thermal insulation. Heat treatment at 120°C can also improve its mechanical properties and water resistance, although it slows biodegradation.

“We demonstrate that it is possible to develop high-quality electronic components without long-term environmental burden – and show solutions for a circular electronics industry,” said Professor Simon Glöser-Chahoud, who calculated the carbon footprint across the material’s life cycle.

The research is detailed in the paper, “From biotechnological residues to biodegradable printed circuit boards: Aspergillus niger mycelium as a structural support material,” published in Cleaner Materials.

About TU Bergakademie Freiberg

Founded in 1765, TU Bergakademie Freiberg is a German resource-focused university whose teaching and research span the raw materials value chain, from exploration and extraction through processing and recycling. Its researchers develop technologies supporting efficient resource use, circular material systems, environmental protection and sustainable energy production. The university is located in Freiberg, Saxony, Germany. For more information, please click here

Source/Photo Credit: TU Bergakademie Freiberg


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Molly Bakewell Chamberlin
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